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Monday, October 7, 2024 - 08:37

Discover: Fan-Out Wafer-Level Packaging - CEA-Leti

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CEA-Leti offers a competitive Fan-Out Wafer-Level Packaging technology using 8” wafers. Based on the reconstruction of substrates around individual chips, this technology has become an iconic part of any “More than Moore” strategy. This advanced technology has enabled high-potential, multi-chip system-in-packages since the mid-2000s. 
Eliminating the need for intermediate, laminated substrates has enabled the integration of high performance systems with a reduced cost and footprint. It has also paved the way for applications that would have been difficult to address using conventional packaging.